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  <title>Daniel L. Revier</title>
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    <div class="me">
      <img src="images/me_and_ridley.jpg" alt="Daniel Revier with his daughter Ridley on his shoulders" width="300px">
    </div>
    <h1>
      Daniel L. Revier
      <br>
      <span style="font-size: 14pt;">he/him</h1>
    <h3>
      PhD Student
      <br>
      <span style="font-size: 12pt; font-weight: normal;">University of Washington</span>
    </h3>
    <p class="email">
      <span class="tt">drevier@uw.edu</span>
      <br>
    </p>
    <p>
      I am a PhD student at the University of Washington Computer Science Department, where I am focused on
      computational fabrication and physical simulation. I specialize in the mechanics of metamaterials and discrete
      elastic rod (DER) simulation.
    </p>
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  <br>
  <hr>
  <ul class="nav">
    <li><a href="#news">News</a></li>
    <li><a href="#about-me">About Me</a></li>
    <li><a href="#publications">Publications</a></li>
    <li><a href="#projects">Projects</a></li>
    <li><a href="#patents">Patents</a></li>
  </ul>
  <div style="clear: both;"></div>
  <hr>
  <!-- <a name="news"></a> -->
  <section id="news">
    <h2>News</h2>
    <p>
      <span class="date-inline">December 13, 2022</span>
      <br>
      I made this webpage in order to present my work to the world. It is currently a work in progress.
    </p>
  </section>
  <section id="about-me">
    <h2>About Me</h2>
    <p>
      I am a PhD student at the University of Washington Computer Science Department. My focus in on computational
      fabrication of mechanical metamaterials with stochastic or regular connectivity.
    </p>
    <p>
      This is my academic homepage. I received my undergraduate degree from Texas A&amp;M University in Electrical
      Engineering in 2012. I then worked full-time at the Georgia Tech Research Institute as a research engineer
      designing
      high-power radar systems. Simultaneously, I completed my master's degree in Electrical Engineering by creating a
      one-tool, hybrid-manufacturing approach to fabricating planar radio frequency structures. I then took a job at
      Texas Instruments where I was the principle engineer applying inkjet printing technology to wafer level packaging.
    </p>
    <p>
      I returned to academic life in 2019 after working at Texas Instruments. In my time working with 3D printing (aka
      additive manufacturing aka digital fabrication) I felt that software was the limiting factor in unlocking the full
      capabilities. This began my search for a PhD program where I could apply my hardware/fabrication background toward
      an application of enhancing people's abilities to design complicated and intricate objects.
    </p>
    <p>
      At the University of Washington I am focused on fabrication and simulation of mechanical metamaterials. My work
      spans planar materials as well as three dimensional stochastic foam-like materials. I apply mathematics, continuum
      mechanics, and
      physical simulation techniques to turn the intractable space of metamaterial design into an intutive and
      accessible design space.
    </p>
  </section>
  <section id="publications">
    <h2>
      Publications
      <span style="font-size: 12pt; font-weight: normal;">
        (in reverse chronological order)
        <a href="https://scholar.google.com/citations?user=GcBLKLwAAAAJ&hl=en&oi=aom">Google Scholar</a>
      </span>
    </h2>
    <ul class="pubs">
      <li>
        <span class="title">
          Applied Viscous Thread Instability for Manufacturing 3D Printed Foams
        </span>
        <br>
        <span class="authors">
          Brett Emery, Daniel Revier, Jeff Lipton
          <br>
          Proceedings of the 7th Annual ACM Symposium on Computational Fabrication, 1-2
        </span>
      </li>
      <li>
        <span class="title">
          Expanding the Design Space for Electrically-Driven Soft Robots Through Handed Shearing Auxetics
        </span>
        <br>
        <span class="authors">
          I Good, T Brown-Moore, A Patil, D Revier, JI Lipton
          <br>
          2022 International Conference on Robotics and Automation (ICRA), 10951-10957, 2022
        </span>
      </li>
      <li>
        <span class="title">
          Kinematic Modeling of Handed Shearing Auxetics via Piecewise Constant Curvature
        </span>
        <br>
        <span class="authors">
          A Garg, I Good, D Revier, K Airis, J Lipton
          <br>
          2022 IEEE 5th International Conference on Soft Robotics (RoboSoft), 423-430, 2022
        </span>
      </li>
      <li>
        <span class="title">
          The Principles of "Smart" Encapsulation: Using Additive Printing Technology for the Realization of Intelligent
          Application-Specific Packages for IoT, 5G, and Automotive Radar Applications
        </span>
        <br>
        <span class="authors">
          B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris
          <br>
          2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018
        </span>
      </li>
      <li>
        <span class="title">
          A low-cost, single platform, hybrid manufacturing system for RF passives
        </span>
        <br>
        <span class="authors">
          DL Revier, MM Tentzeris
          <br>
          2017 IEEE Radio and Wireless Symposium (RWS), 83-85, 2017
        </span>
      </li>
      <li>
        <span class="title">
          Additively manufactured nanotechnology and origami-enabled flexible microwave electronics
        </span>
        <br>
        <span class="authors">
          JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, B Tehrani, A Traille, BS Cook, MM
          Tentzeris
          <br>
          Proceedings of the IEEE 103 (4), 583-606, 2015
        </span>
      </li>
      <li>
        <span class="title">
          Beam former development for the NASA Hurricane Imaging Radiometer
        </span>
        <br>
        <span class="authors">
          G Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, MC Bailey
          <br>
          2015 IEEE Aerospace Conference, 1-15, 2015
        </span>
      </li>
      <li>
        <span class="title">
          Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate
        </span>
        <br>
        <span class="authors">
          BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, MM Tentzeris
          <br>
          2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014
        </span>
      </li>
      <li>
        <span class="title">
          Beam former development for the NASA Hurricane Imaging Radiometer
        </span>
        <br>
        <span class="authors">
          G Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, MC Bailey
          <br>
          2015 IEEE Aerospace Conference, 1-15, 2015
        </span>
      </li>
    </ul>
  </section>
  <section id="projects">
    <h2>Projects</h2>
    <p>
      Coming soon...
    </p>
  </section>
  <section id="patents">
    <h2>
      Patents
      <span style="font-size: 12pt; font-weight: normal;">
        (in reverse chronological order)
        <a href="https://scholar.google.com/citations?user=GcBLKLwAAAAJ&hl=en&oi=aom">Google Scholar</a>
      </span>
    </h2>
    <ul class="pubs">
      <li>
        <span class="title">
          Molded Packaged Antenna
        </span>
        <br>
        <span class="authors">
          L Stiborek, B Alexey, DL Revier
          <br>
          US Patent 11,271,2960
        </span>
      </li>
      <li>
        <span class="title">
          Nanoparticle Backside Die Adhesion Layer
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier, S Naseem, MH Chowdhury
          <br>
          US Patent 11,031,364
        </span>
      </li>
      <li>
        <span class="title">
          3D Printed Semiconductor Package
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,910,465
        </span>
      </li>
      <li>
        <span class="title">
          Lens Cleaning Via Electrowetting
        </span>

        <br>
        <span class="authors">
          DL Revier, BS Cook, DP Magee, SJ Fedigan
          <br>
          US Patent 10,908,414
        </span>
      </li>
      <li>
        <span class="title">
          Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,886,187
        </span>
      </li>
      <li>
        <span class="title">
          Semiconductor Package with Liquid Metal Conductors
        </span>
        <br>
        <span class="authors">
          DP Parekh, BS Cook, DL Revier, J Bito
          <br>
          US Patent 10,879,151
        </span>
      </li>
      <li>
        <span class="title">
          3D Printed Semiconductor Package
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,861,715
        </span>
      </li>
      <li>
        <span class="title">
          Acoustic Management in Integrated Circuit Using Phononic Bandgap Structure
        </span>
        <br>
        <span class="authors">
          DL Revier, BS Cook
          <br>
          US Patent 10,833,648
        </span>
      </li>
      <li>
        <span class="title">
          Integrated Circuit Using Photonic Bandgap Structure
        </span>

        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,788,367
        </span>
      </li>
      <li>
        <span class="title">
          Methods and Apparatus for Surface Wetting Control
        </span>
        <br>
        <span class="authors">
          DL Revier, BS Cook, DP Magee, SJ Fedigan
          <br>
          US Patent 10,780,467
        </span>
      </li>
      <li>
        <span class="title">
          Integrated Circuit Package with Stress Directing Material
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,622,270
        </span>
      </li>
      <li>
        <span class="title">
          Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,577,754
        </span>
      </li>
      <li>
        <span class="title">
          Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields
        </span>
        <br>
        <span class="authors">
          DL Revier, SA Kummerl, BS Cook
          <br>
          US Patent 10,553,573
        </span>
      </li>
      <li>
        <span class="title">
          Electromagnetic Interference Shield Within Integrated Circuit Encapsulation Using Photonic Bandgap Structure
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,497,651
        </span>
      </li>
      <li>
        <span class="title">
          Galvanic Signal Path Isolation in an Encapsulated Package Using a Photonic Structure
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,444,432
        </span>
      </li>
      <li>
        <span class="title">
          Integrated Circuit with Dielectric Waveguide Connector Using Photonic Bandgap Structure
        </span>
        <br>
        <span class="authors">
          BS Cook, DL Revier
          <br>
          US Patent 10,371,891
        </span>
      </li>
      <li>
        <span class="title">
          Methods and Apparatus Providing a Graded Package for a Semiconductor
        </span>
        <br>
        <span class="authors">
          DL Revier, BS Cook
          <br>
          US Patent 10,170,3840
        </span>
      </li>
    </ul>
  </section>
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